Diamond Wire Saw

Precision slicing with high yield, tight tolerances, and long wire life for semiconductor and hard-material wafer production.

Plated Diamond Wire Saw for Slicing, Wafering, Cutting, Cropping and Bricking

Precision slicing with high yield, tight tolerances, and long wire life for semiconductor and hard-material wafer production.

UniGrit Technologies’ plated diamond wire is engineered for high-precision slicing and wafer production. By combining premium synthetic (or natural, as specified) diamond grit, a controlled plating architecture, and high diamond exposure, this wire delivers superior cut quality, minimal kerf loss, and consistent performance. It is especially suited to semiconductor wafer sawing (silicon, SiC, GaN, etc.), but remains effective for ceramics, quartz, sapphire, glass, and other difficult-to-cut materials. Rigorous manufacturing tolerances and strong engineering support ensure uniform wire diameter, diamond distribution, and robust performance under high load.

Features / Characteristics

Feature	Technical Benefit
Tightly controlled diamond size & concentration	Ensures predictable slicing rate and minimal variation in cut depth or rate.
Uniform wire diameter & even diamond distribution (no clustering)	Promotes stable tension, consistent cut kerf, reduces wire vibration and buffing.
Engineered high diamond-exposure ratio	Maximises cutting action per pass, accelerates slicing while reducing mechanical load.
Precise control over kerf, TTV (Total Thickness Variation), bow/warp	Critical for semiconductor wafers where post-processing cost is high; reduces downstream polishing / grinding.
Superior surface finish and minimal edge chipping	Minimises subsurface damage; enhances die yield and edge reliability.

Material Workpieces / Ideal For

Wafering / Semiconductor-Focused Materials:
Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN), Sapphire, Quartz, Aluminium Nitride (AlN).
Other Difficult-to-Cut Materials:
Ceramics, Glass, Precious Metals, Magnetic Materials, Composite Substrates.

Applications

Primary Semiconductor Wafer Production: ingot cropping/slabbing, wafer slicing, prime wafer finishing.
Wafer Fabrication & Processing: LED substrate thinning, back-grinding, precision dicing.
Optoelectronics & Power Electronics: SiC / GaN devices, power MOSFETs, diodes.
Other Industries: High-performance ceramics, precision glass for optics, medical device substrates.

Key Market Segments

Semiconductor fabs and wafer foundries
Solar and photonics (PV)
Power electronics / EV / Renewable Energy
Optoelectronics / LED / Display
Medical equipment

UniGrit Technologies Diamond Wire Specifications & Availability

Notes:
1) ^{wire breaking strength}

2) ^{low, middle, high concentration with continuous quality}

3) ^{lengths to 5, 10, 20, 30km, 50km, +100km}